Method of bonding thermoplastic material using radio...

Details Method of bonding thermoplastic material using radio... Method of bonding thermoplastic material using radio...

B - Operations, Transporting

29

C

154/71.01

B29C 65/32 (2006.01) B29C 65/18 (2006.01) B32B 27/08 (2006.01) B32B 27/30 (2006.01) B32B 31/20 (1990.01)

Patent

CA 1286966

METHOD OF BONDING THERMOPLASTIC MATERIAL USING RADIO FREQUENCY ENERGY Abstract Of The Disclosure Thermoplastic materials having a low dielectric loss tangent and loss index are bonded together using radio frequency energy by employing a polyvinyl chloride buffer above and below the ma- terials being bonded while applying pressure and rf energy. The polyvinyl chloride is a highly plasticized polyvinyl chloride which has a bonding temperature lower than the bonding temperature of the material being bonded. In spite of the fact that the bonding temperature of the polyvinyl chloride is lower than the bonding temperature of the low loss material an effective bond is produced between the low loss material.

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