Method and apparatus for low temperature, low pressure...

C - Chemistry – Metallurgy – 30 – B

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C30B 25/02 (2006.01) C23C 16/24 (2006.01) C30B 29/06 (2006.01) H01L 21/205 (2006.01)

Patent

CA 1328796

ABSTRACT OF THE DISCLOSURE A method and apparatus for depositing single crystal, epitaxial films of silicon on a plurality of substrates in a hot wall, isothermal deposition system is described. The deposition temperatures are less than about 800°C, and the operating pressures during deposition are such that non-equilibrium growth kinetics determine the deposition of the silicon films. An isothermal bath gas of silicon is produced allowing uniform deposition of epitaxial silicon films simultaneously on multiple substrates. This is a flow system in which means are provided for establishing an ultrahigh vacuum in the range of aobut 10-9 Torr prior to epitaxial deposition. The epitaxial silicon layers can be doped in-situ to provide very abruptly defined regions of either n- or p-type conductivity.

544049

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