Dip carrier

H - Electricity – 01 – L

Patent

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H01L 23/04 (2006.01) H05K 9/00 (2006.01)

Patent

CA 1287189

F.N. 42861 CAN 1A Abstract of the Disclosure A single dual in-line package integrated circuit component carrier adapted to provide mechanical and static shielding protection is box like with spaced pairs of walls to minimize the size of the carrier but accommodate the 300, 400 or 600 mil DIP component.

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