Thermoplastic molding compounds of polyamide and...

C - Chemistry – Metallurgy – 08 – L

Patent

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400/4603, 400/58

C08L 77/00 (2006.01)

Patent

CA 1340019

The invention relates to thermoplastic molding compounds of 70 to 99.5% by weight thermoplastic polyamides and 30 to 0.5% by weight hydrogenated nitrile rubber and 0 to 29.5% by weight thermoplastic resin components and, optionally, standard additives in typical quantities. These thermoplastic molding compounds show high strength values, very good moldability and, above all, high weathering resistance.

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