C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/125
C25D 17/00 (2006.01) C25D 5/08 (2006.01) C25D 17/06 (2006.01) H05K 3/24 (2006.01)
Patent
CA 1190514
ABSTRACT Apparatus for electroplating flat planar workpieces e.g. printed circuit boards has a receptacle for containing the electrolyte solution and a conveyor for transporting racks supporting the workpieces through the receptacle with the workpieces moving in their own plane. The electrolyte is pumped to a manifold in the bottoms of the receptacle with towers extending upwardly from the manifold in longitudinal rows on each side of the path of the workpeices. The elec- trolyte is sprayed toward the workpieces from nozzles on the towers. A primary power supply is connected between the racks for the workpieces and containers of pellets of the metal to be plated which are immersed in the electrolyte. An auxiliary power source is connected between the workpiece racks and insoluble electrode grills between the towers and the workpeice path. The spraying arrangement allows the el- ectrolyte to be sprayed at high pressure and flow rate against the surfaces of the workpiece, and the insoluble electrode grills can be at a potential different from that between the workpiece and the metal to be plated to enhance the plating characteristics and permit high speed plating at high current densities.
403613
Martin Thomas A.
Scanlon George R.
Napco Inc.
Ridout & Maybee Llp
LandOfFree
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