C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5048
C08L 63/10 (2006.01) C08G 59/50 (2006.01) C08G 59/56 (2006.01) C08L 63/00 (2006.01) H05K 3/28 (2006.01)
Patent
CA 1235545
Abstract of the Disclosure An epoxy resin composition comprising an epoxy resin, either 2-vinyl-4,6-diamino-s-triazine or 2-vinyl- 4,6-diamino-s-triazine/isocyanuric acid adduct, and at least one compound selected from dicyandiamide, polyvinyl-p-phenol and specific imidazole compounds. The composition is useful, for example, in inks, insulating paints and adhesives for printed circuit base boards and in copper-clad laminated boards.
484733
Kamagata Kazuo
Kawata Shunichi
Mizui Takashi
Yamada Toshiaki
Shikoku Chemicals Corporation
Shikoku Finechemicals Corporation
Smart & Biggar
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