Method of copper plating gravure cylinders

Details Method of copper plating gravure cylinders Method of copper plating gravure cylinders

C - Chemistry, Metallurgy

25

D

204/14, 204/36

C25D 3/38 (2006.01) C25D 7/04 (2006.01)

Patent

CA 1189820

- 1 - Abstract of the Disclosure A method is provided for depositing on a gravure roll a layer of copper especially adapted to receive electronic engraving comprising the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 grams/liter of copper sulfate from about 35 to about 90 grams/liter of sulfonic acid, from about 1 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about .3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound; and passing electrical current through the bath to deposit copper on said roll.

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