Magnetron cathode sputtering apparatus

Details Magnetron cathode sputtering apparatus Magnetron cathode sputtering apparatus

H - Electricity

01

J

204/167.2

H01J 37/34 (2006.01)

Patent

CA 1179637

ABSTRACT OF THE DISCLOSURE A rotatable magnetron cathode sputtering apparatus for operation within an evacuable chamber for coating substrates that are also contained within said chamber. The cathode comprises an elongated cylindrical tube having a layer of the coating material or materials to be sputtered applied to the outer surface thereof. Magnetic means is mounted within the tube and includes at least one row of permanent U-shaped magnets extending lengthwise of the tube. The tube is horizontally disposed and rotatable mounted in the coating chamber such that it can be turned on its longitudinal axis relative to the magnets to selectively bring different portions or segments of the same sputtering material or different sputtering materials into sputtering position with respect to the magnets and within the magnetic field. Means is also provided for internally cooling the cathode.

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