Method and apparatus for dip tinning

Details Method and apparatus for dip tinning Method and apparatus for dip tinning

H - Electricity

01

R

113/87

H01R 9/16 (2006.01)

Patent

CA 1256323

ABSTRACT OF THE DISCLOSURE An apparatus for tinning electronic components wherein a plurality of fingers are mounted on a closed loop carrier means for carrying the components through the various steps of the process. The fingers are actuated to move into and out of a component engaging position at different work stations.

473096

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