H - Electricity – 01 – L
Patent
H - Electricity
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L
356/3
H01L 23/46 (2006.01) H01L 23/34 (2006.01) H01L 23/42 (2006.01) H01L 23/473 (2006.01) H05K 7/20 (2006.01)
Patent
CA 1295753
25307-192 ABSTRACT OF THE DISCLOSURE A cooling system used with a printed circuit board having at least a solid circuit component thereon, comprising a cooling header and cooling modules connected to the cooling head- er. Each of the cooling modules engages one of the components. The cooling module has a heat transfer plate connected to one end of a bellows which is connected to the cooling header at the other end. A layer of thermally conductive compound such as a layer of thermal grease is interposed between the heat transfer plate and the corresponding circuit component. The thermally conductive layer is initially pressed with a pressure higher than a critical pressure, and thereafter, the pressure is reduced to working pressure exerted on the circuit component provided by the resilient force of the bellows and the hydraulic pressure of the coolant. The critical pressure is predetermined experimentally. As a result, the thermal contact resistance between the heat tran- sfer plate and the circuit component is favorably reduced and stabilized.
566836
Suzuki Masahiro
Udagawa Yoshiaki
Yamamoto Haruhiko
Fetherstonhaugh & Co.
Fujitsu Limited
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