Low-cost, highly filled, wax-based hot melt adhesives and...

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 7/02 (2006.01) B32B 17/02 (2006.01) C09J 123/08 (2006.01) C09J 191/08 (2006.01) D21H 19/44 (2006.01)

Patent

CA 1136930

-14- Abstract This invention relates to hot melt adhesives for use in coating and/or laminating paper. Conventional hot melt adhesives used to manufacture a coated or laminate product with good vapor barrier characteristics are based on ingredients compounded with significantly lower proportions of inert low cost filler materials. The present invention provides a hot melt adhesive/ coating blend which not only provides a moisture vapor barrier and/or bonding but also significantly reduces the quantity of more expensive ingredients through the use of a large quality of a lower cost ultra fine ground inert inorganic filler material and a low cost modifying hydrocarbon resin. The blend or composition consists essentially of, in parts by weight, up to about 25 parts of a hi melt point paraffin wax, 10-30 parts of a modifying hydrocarbon resin, 1-20 parts of an elastomeric copolymer, and 20-85 parts of an inert inorganic filler material. Preferably the blend additionally contains up to about 25 parts of a microcrystalline wax. The material is inexpensive, can be readily reactivated by heating, can be applied as a continuous coating, has excellent non-blocking and MVTR properties, holds the filler material in suspension, is inexpensive, has good polymeric tensile properties, is not tacky when cold, has good cold cracking resistance at low temperature and may be readily recycled.

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