Thermoplastic resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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400/3077

C08L 51/06 (2006.01) C08L 23/08 (2006.01) C08L 77/00 (2006.01)

Patent

CA 1231489

ABSTRACT OF THE DISCLOSURE THERMOPLASTIC RESIN COMPOSITION A novel thermoplastic resin composition is provided. It has excellent balance in the physical properties and is usable as shaped articles, sheets and films having excellent appearance in uniformity and smoothness. The thermoplastic resin composition is a blend of a resin composition (D) defined below and a copolymer (C) containing epoxy groups, said resin composition (D) being composed of polypropylene modified by an unsaturated carboxylic acid or an anhydride thereof with or without unmodified polypropylene, and a polyamide resin. The copolymer (C) is composed of an unsaturated epoxy compound and ethylene, with or without an ethylenically unsaturated compound other than ethylene.

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