Molding polyamide composition

Details Molding polyamide composition Molding polyamide composition

C - Chemistry, Metallurgy

08

L

400/5801, 400/78

C08L 77/00 (2006.01) C08G 69/26 (2006.01) C08K 3/00 (2006.01) C08K 3/10 (2006.01) C08K 3/34 (2006.01) C08K 3/36 (2006.01)

Patent

CA 1268577

Abstract of the Disclosure Disclosed is a molding reinforced polyamide composition comprising [A] a polyamide selected from a polyamide composed of (a) aromatic dicarboxylic acid component units comprising 60 to 77 mole% of terephthalic acid component units and 23 to 40 mole% of aromatic dicarboxylic acid component units other than terephthalic acid component units and (b) 1,6- diaminohexane units and a polyamide composed of (a) aromatic dicarboxylic acid component units comprising 60 to 100 mole% of terephthalic acid component units and 0 to 40 mole% of aromatic dicarboxylic acid component units other than terephthalic acid component units and (b) units of a linear aliphatic alkylene-diamine component having 7 to 18 carbon atoms, and [B] a filler in an amount of 0.5 to 200 parts by weight per 100 parts by weight of said polyamide. This composition has excellent heat resistance characteristics, mechanical properties, chemical and physical properties and molding characteristics in combination.

473655

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