Copper conductor composition for porcelain enamel steel...

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117/102, 31/156

H01B 1/22 (2006.01) H01B 1/16 (2006.01) H01B 1/20 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1190736

ABSTRACT OF THE DISCLOSURE A thick film conductor composition is disclosed. The composition consists essentially of an admixture of finely divided particles of 65 to 80 parts by weight copper metal powder, 1.5 to 6 parts by weight copper oxide, and 3 to 8 parts by weight low melting temperature glass frit which sinters at 550° to 700°C dispersed in an organic vehicle comprising 20% to 40% by weight methacrylate resin dissolved in a volatile solvent. The thick film conductor composition is adapted for use with porcelain enamel steel.

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