Integrated circuit package

Details Integrated circuit package Integrated circuit package

H - Electricity

01

L

356/143

H01L 23/04 (2006.01) H01L 23/057 (2006.01) H01L 23/48 (2006.01) H01L 23/498 (2006.01) H01L 23/66 (2006.01)

Patent

CA 1278882

SO2-48579M/KH/88 ABSTRACT OF THE DISCLOSURE An improved integrated circuit package of the MLCP type suitable for use both at high operating frequencies and with chips dissipating large amounts of power. Electric power supplying wirings and signal transmitting wirings are disposed on entirely separate surfaces, the power transmitting wirings being formed on entire peripheries of respective, dedicated ceramic plates. Termination resistors for the signal wirings though are formed on the same ceramic plates which contain the power supplying wirings.

556862

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