High solids polyamide-imide magnet wire enamel

C - Chemistry – Metallurgy – 08 – G

Patent

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117/196, 402/217

C08G 73/14 (2006.01) B05D 7/20 (2006.01) C08G 18/34 (2006.01) H01B 3/30 (2006.01)

Patent

CA 1193044

Abstract A high solids content, low molecular weight polymer, low viscosity polyamide-imide enamel is described. The enamel is a reaction product of polyisocyanate, trimellitic anhydride, and an isocyanate blocking alcohol having a ratio of free isocyanate to total carboxyl and anhydride groups of 0.99:1 to 0.85:1. The method of making the enamel and the method of coating electrical conductors such as magnet wire with such enamel are also disclosed.

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