Structure for temperature detection in a package

Details Structure for temperature detection in a package Structure for temperature detection in a package

H - Electricity

05

K

356/3

H05K 1/02 (2006.01) G01K 1/16 (2006.01)

Patent

CA 1303239

66446-473 ABSTRACT Disclosed is a structure for detecting the temperature of a package having a substrate mounting a plurality of integrated circuit (IC) chips. It is known to provide an IC package with a temperature sensor so that if the sensed temperature exceeds a predetermined value, a protective measure such as an interruption of power supply can be taken. However, prior art temperature sensing struct- ures have the disadvantage that a part protrudes from the IC package and is apt to be hit and damaged when the IC package is mounted, dismounted or transported. An associated cable connection can also be damaged. The present invention avoids those disadvantages by providing a temperature sens- ing block for a circuit mounting a plurality of IC chips, each accommodated in a chip carrier, there being a cold plate facing the IC chips at a small distance therefrom for performing heat exchange with a coolant. A temperature sensing block including a case is mounted on the circuit board and has the same height as the chip carriers, at least one temperature sensor being accommodated in the case, A heat conducting medium fills small clearances defined between the cold plate and the IC chips and the temperature sensing block.

609414

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