Low toxicity alloy compositions for joining and sealing

Details Low toxicity alloy compositions for joining and sealing Low toxicity alloy compositions for joining and sealing

C - Chemistry, Metallurgy

22

C

148/60, 75/91

C22C 13/00 (2006.01) B23K 35/24 (2006.01) B23K 35/26 (2006.01) C22C 13/02 (2006.01)

Patent

CA 1299470

ABSTRACT OF THE DISCLOSURE LOW TOXICITY ALLOY COMPOSITIONS FOR JOINING AND SEALING A lead free alloy for joining and sealing which is useful as a plumbing solder comprises from 0.08 to 20% by weight of bismuth, from 0.02 to 1.5% by weight of copper, from 0.01 to 1.5% by weight of silver, from 0 to 0.10 percent by weight of phosphorus, from 0 to 0.20% of a rare earth mixture and the balance tin, together with incidental impurities. The alloy has a similar pasty range (i.e. melting temperature and melting range) to the traditional tin-lead plumbing solders.

595140

Affiliated with

Also associated with

Rating

Low toxicity alloy compositions for joining and sealing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low toxicity alloy compositions for joining and sealing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low toxicity alloy compositions for joining and sealing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1264496