Process and composition for the immersion deposition of gold

Details Process and composition for the immersion deposition of gold Process and composition for the immersion deposition of gold

C - Chemistry, Metallurgy

23

C

6/4, 117/77

C23C 18/42 (2006.01)

Patent

CA 1177204

ABSTRACT The invention is concerned with a process for electroless plating gold on a substrate which comprises immersing such substrate in an electroless gold plating bath which comprises a trivalent gold complex selected from alkali metal auricyanides and alkali metal auric imides in an amount which is at least sufficient to de- posit gold on the substrate up to the maximum solubili- ty of the complex in the bath, and at least one of the following ingredients: (a) an organic carboxylic acid, and (b) a mineral acid in an amount sufficient to adjust the pH of the bath to from about 0.1 to 6Ø The substrate is maintained immersed in the bath. with- out the passage of electrical current therethrough, for a period of time sufficient to form an immersion deposit of gold on the substrate.

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