H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/18, 18/63
H05K 1/00 (2006.01) H05K 1/11 (2006.01) H05K 3/10 (2006.01) H05K 3/28 (2006.01) H05K 3/40 (2006.01) H05K 3/42 (2006.01) H05K 3/06 (2006.01) H05K 3/18 (2006.01)
Patent
CA 1307857
ABSTRACT OF THE DISCLOSURE A printed circuit board includes an injected molded substrate having a pattern recessed in the substrate surface of interconnects, through-connections and contact surfaces. A trench- shaped depression is provided in the substrate surface in the region of each interconnect, and a planar depression is provided in the substrate's surface in at least one of (a) the region of each through-connection and (b) the region of each contact surface. The pattern of recesses is covered with a conductive metal coat, and the depth of each planar depression is greater than the depth of each trench-shaped depression, so that the metal coat fills the trench-shaped depressions to the surface of the substrate, while in the planar depressions a distance remains between the metal coat and the surface of the substrate. A solder stop lacquer can then be applied such as by roller coating, without the necessity of photo-structuring and without filling the planar depressions.
614207
Aktiengesellschaft Siemens
Fetherstonhaugh & Co.
Schmidt Hans-F.
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