G - Physics – 01 – L
Patent
G - Physics
01
L
73/3
G01L 9/00 (2006.01) G01L 9/06 (2006.01)
Patent
CA 1308933
ABSTRACT OF THE DISCLOSURE A method of measuring a semiconductor pressure sensor comprises the steps of mounting a wafer formed with diaphragm type semiconductor pressure sensors on a wafer stage, evacuating air existing between the back surface side of said diaphragm type semiconductor pressure sensors and said wafer stage through at least one hole provided in said wafer stage to deform, diaphragms of said semiconductor pressure sensors, and measuring the pressure sensitivity of each of said semiconductor pressure sensors from the surface side of said semiconductor pressure sensors.
550325
Nishiguchi Masanori
Sogawa Ichiro
Sunago Katsuyoshi
Riches Mckenzie & Herbert Llp
Sumitomo Electric Industries Ltd.
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