Method of screen printing conductive elements

Details Method of screen printing conductive elements Method of screen printing conductive elements

H - Electricity

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H01L 21/60 (2006.01) G01N 27/414 (2006.01) H01L 21/56 (2006.01) H01L 21/58 (2006.01) H01L 23/48 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1218468

ABSTRACT OF THE DISCLOSURE The invention relates to a method of establishing electrical connections to a semiconductor device which comprises the steps of: providing a semiconductor chip with a plurality of contacts points; providing a base to hold and position the chip; mounting the chip to the base; and printing a plurality of conductive elements on the base and onto the contact points of the chip to provide electrical connections thereto. The invention also relates to a semiconductor device resulting from said method.

439427

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