Print transfer article

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H - Electricity

05

K

356/6

H05K 3/20 (2006.01) H05K 3/12 (2006.01) H05K 3/46 (2006.01) H05K 1/09 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1217569

-195- ABSTRACT OF THE DISCLOSURE Described herein is a composite structure comprising (a) a solid dielectric support surface; (b) a layer or pathway comprising a thermoset resin and containing sufficient electrically conductive metal particles, in the configuration of at least an electric circuit element, to provide desired properties and preferably to satisfy the Soldering Standard Test (hereinafter defined) and preferably to provide an electric circuit element having a low surface resistivity of 0.1 ohm per square or less. Also described are inks for printed circuit devices, circuit transfer means, and methods for making the same.

456931

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