H - Electricity
05
K
113/89
H05K 3/34 (2006.01) B23K 1/012 (2006.01) B23K 3/00 (2006.01) H01R 43/02 (2006.01)
Patent
CA 1293653
ABSTRACT OF THE DISCLOSURE Device for delivering heated fluid to the sides of a component to melt solder at terminals disposed at the periphery of the component. The device includes a nozzle for delivering heated fluid generally in a first direction to the sides of the component, and a baffle disposed within or above the nozzle for directing the heated fluid generally laterally with respect to the first direction prior to delivery of the heated fluid towards the sides of the component. The nozzle has down- wardly extending sides, and the sides are dimensioned so that the component can be accommodated within the nozzle the baffle produces good distribution and mixing of heated air above and about the terminals, and this avoids the generation of hot spots, and produces simultaneous or essentially simultaneous melting of the solder at all of the leads to facilitate quick and convenient attachment of the com- ponent to or removal of the component from a printed circuit board. The downwardly extending sides of the nozzle are preferably vertically oriented with respect to the printed circuit board while the lower edges thereof are disposed at least below the body of the component such that heated fluid is forced through a constricted space as it passes the com- ponent terminals to thus optimize transfer of heat from the fluid to the solder at the terminals.
512019
Coffman Bradford W.
Siegel William J.
Borden Ladner Gervais Llp
Pace Incorporated
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