Metallic impurity control for electroless copper plating

Details Metallic impurity control for electroless copper plating Metallic impurity control for electroless copper plating

C - Chemistry, Metallurgy

23

C

6/4, 117/80

C23C 18/40 (2006.01)

Patent

CA 1184359

Abstract of the Disclosure A process and composition for use in electroless copper plating where the process includes contacting a substrate with a solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster. A stabilizer and a rate controller may also be used. The improvement of the present invention in- cludes contacting the substrate with a solution further compris- ing a hydroxy compound present in an amount effective to complex metallic impurities present in the solution. Sodium gluconate, sodium glucoheptonate, sorbitol, mannitol, glycerol, fructose, and glucose are among. the hydroxy compounds suitable for use. The improved solution is relatively stable, easy to control, and is of versatile use.

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