C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5301
C08L 75/04 (2006.01) C08G 18/10 (2006.01) C08L 67/00 (2006.01) C08L 71/00 (2006.01) C09D 175/04 (2006.01)
Patent
CA 1247769
Abstract of the Disclosure A low temperature curing composition prepared from an essentially silicon-free polymer and a silicon group-containing material is improved by utilizing a silicon group-containing material which is a hydrolyzable organosilicon group-containing polymer which is non-gelled and formed from an essentially silicon-free polymer having isocyanate or active hydrogen functional groups and an organosilicon group-containing material having functional groups reactive with the isocyanate and active hydrogen.
457605
Chang Wen-Hsuan
Piccirilli Robert
Borden Ladner Gervais Llp
Ppg Industries Ohio Inc.
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