Semiconductor package

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H - Electricity

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L

356/143

H01L 23/28 (2006.01) H01L 23/057 (2006.01) H01L 23/06 (2006.01) H01L 23/10 (2006.01) H01L 23/14 (2006.01) H01L 23/367 (2006.01)

Patent

CA 1303251

-37- 18110-MB ABSTRACT OF THE DISCLOSURE A semiconductor package for an electrical component has a metal or metal alloy leadframe adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to copper or copper alloy base and cap members. The cap and base members have coated to their inside surfaces a metal or metal alloy which improves the polymer bond.

587086

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