H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/131, 356/134
H05K 7/02 (2006.01) H01L 21/00 (2006.01) H01L 21/60 (2006.01) H01L 23/495 (2006.01) H05K 1/02 (2006.01) H05K 7/20 (2006.01) H05K 1/09 (2006.01)
Patent
CA 1086430
METHOD AND APPARATUS FOR THE ASSEMBLY OF SEMICONDUCTOR DEVICES ABSTRACT OF THE DISCLOSURE A dual-in-line plastic package for an integrated circuit is assembled with the use of a thermal stress-resistant thin-film interconnect pattern on a flexible insulator film. All electrical connections to the semiconductor chip are made simultaneously by bonding directly to the thin-film inter- connect pattern. Each segment of the interconnect pattern is then connected simultaneously to a simplified external lead frame, by means of a novel soldering technique. The assembly is then ready for plastic encapsulation and final trimming. By supplying both the flexible interconnect pattern and the external lead frame in continuous coils or reels, a high degree of handling simplicity, speed and accuracy is achieved with a maximum opportunity for automation, to produce a low work content product.
177075
Kirby Eades Gale Baker
Texas Instruments Incorporated
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