Apparatus for cooling integrated circuit chips

Details Apparatus for cooling integrated circuit chips Apparatus for cooling integrated circuit chips

H - Electricity

01

L

356/113

H01L 23/46 (2006.01)

Patent

CA 1189636

ABSTRACT OF THE DISCLOSURE A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the hoard. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bunches of heat conducting strands extend into the first cooling portion so that each bunch is urged into deflecting contact with a respective chip. A fluid inlet and outlet are provided in the second cooling portion.

416183

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