Photopolymerizable resin composition

Details Photopolymerizable resin composition Photopolymerizable resin composition

C - Chemistry, Metallurgy

08

L

400/5163, 204/91

C08L 33/00 (2006.01) C08J 3/28 (2006.01) C09D 4/06 (2006.01) G03F 7/033 (2006.01)

Patent

CA 1236236

ABSTRACT OF THE DISCLOSURE A photopolymerizable resin composition for aqueous-developing type dry film resists which comprises (A) 40 to 85% by weight of a binder resin comprising a copolymer of methyl methacrylate, methyl acrylate and methacrylic acid, (B) 15 to 60% by weight of a crosslinkable monomer having at least two ethylenically unsaturated groups in the molecule, and (C) 0.5 to 10% by weight, based on the total amount of the above components (A) and (B), of a photoinitiator.

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