Board to board interconnect structure

Details Board to board interconnect structure Board to board interconnect structure

H - Electricity

05

K

356/21

H05K 1/14 (2006.01) H05K 7/14 (2006.01)

Patent

CA 1198830

ABSTRACT A board to board interconnect assembly is installed between a first multilayer circuit board and a second multilayer circuit board. The assembly is comprised of a first housing member carrying electrical contacts and a second housing member carrying electrical contacts which mateably engage with the contacts of the first housing member. The first and second circuit boards have corresponding arrays of plated through apertures selectively connected to the circuit layers of the respective boards. Socket carrying contacts are frictionally engaged in certain of the plated through conductive apertures of the first and second circuit boards to secure the first housing member to the first circuit board and the second housing member to the second circuit board. Flex contacts are installed in conductive plated through apertures of the boards opposite each of the socket contacts and are frictionally engaged with the socket contacts. The socket and flex contacts are frictionally coupled to elect- rically connect the circuit layers of the first circuit board with the circuit layers of the second circuit board in a direct vertical relation- ship. The opposed first and second housing members support and position the contacts and serve as spacers between the circuit boards.

435416

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