Process and apparatus to provide the application of glue on...

Details Process and apparatus to provide the application of glue on... Process and apparatus to provide the application of glue on...

H - Electricity

01

L

356/22

H01L 21/64 (2006.01) H01L 21/00 (2006.01) H05K 3/30 (2006.01)

Patent

CA 1175157

ABSTRACT OF THE DISCLOSURE Process and apparatus for providing the application of glue on preselected zones of a printed circuit, according to which provision is made for a tank containing liquid glue, and a series of push rods arranged at preselected positions, which first contact the glue in said tank, then deposit the drops of glue on a hoard for printed circuits.

387181

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