Printed circuit board

Details Printed circuit board Printed circuit board

H - Electricity

05

K

356/6

H05K 1/05 (2006.01)

Patent

CA 1213072

ABSTRACT OF THE DISCLOSURE A composite 24 is characterized by metal or alloy component 26 having a thin interface layer 28 on a surface 30 thereof. Another metal or alloy component 32 has a thin interface layer 34 on its surface 36. A glass 38, having a closely matched coefficient of thermal expansion to the metal or alloy components 26 and 32, bonds the thin inter- face layers 28 and 34 and electrically insulates the first component from the second component whereby thermal stress between the metal or alloy compon- ents and the glass is substantially eliminated.

439317

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