Interconnection of electronic components

Details Interconnection of electronic components Interconnection of electronic components

H - Electricity

01

L

339/114, 26/139,

H01L 21/603 (2006.01) B23K 20/00 (2006.01)

Patent

CA 1311538

Abstract The invention provides a technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires: the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulating material. The invention also provides a bonding head for a wire bonder for bonding the wire to the contact on the first component and for weakening or severing the wire at the desired point.

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