Plastic integrated circuit package having reduced moisture...

Details Plastic integrated circuit package having reduced moisture... Plastic integrated circuit package having reduced moisture...

H - Electricity

01

L

356/143

H01L 23/31 (2006.01) H01L 23/29 (2006.01)

Patent

CA 1255396

ABSTRACT OF THE DISCLOSURE An integrated circuit package for use in environments having a high moisture content has a plastic body having a given length and width and a thickness much less than said given length and width. The thickness exists between upper and lower surfaces of said body. A substantially moisture impervious layer is fixedly attached to the upper and lower surfaces. In a preferred form, the layers are metal selected from aluminum and copper.

531659

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