Lead frame with fusible links

Details Lead frame with fusible links Lead frame with fusible links

H - Electricity

01

L

356/146, 356/66

H01L 23/50 (2006.01) H01L 23/12 (2006.01) H01L 23/48 (2006.01)

Patent

CA 1199424

ABSTRACT: Copper lead frame for manufacturing a semiconductor chip carrier has signal leads extending from outer leads about the periphery of the frame and temporarily attached to a ground bus toward the center of the frame by fusible links. Ground leads extend from bus alternately with signal leads and have fusible links at outer leads which are melted to isolate them from signal leads and eliminate noise between signal leads in finished carrier. A power bus located within the ground bus and a chip mounting pad located within the power bus are similarly positioned by fusible links.

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