C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/27.5
C25D 3/60 (2006.01)
Patent
CA 1316484
ABSTRACT OF THE DISCLOSURE An electroplating bath is disclosed for the formation of a tin-cobalt, tin-nickel, or tin-lead binary alloy coating. The bath is produced by mixing (a) as alloy coating-forming agent a tin salt and one member selected from the group consisting of a cobalt salt, a nickel salt, and a lead salt, (b) 1-hydroxyethane-1, 1- diphosphoric acid and/or a salt thereof, (ç) methanesulfonic acid and/or an alkali salt thereof, and (d) an electroconductive salt. Electroplated coatings formed by using the bath are stable and excellent in gloss.
584062
Fukuoka Kazuhiro
Konishi Haruo
G. Ronald Bell & Associates
Kosaku & Co. Ltd.
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