Chip cooling assembly

Details Chip cooling assembly Chip cooling assembly

H - Electricity

01

L

356/112, 356/3

H01L 23/34 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1195434

ABSTRACT OF THE DISCLOSURE A PC (printed circuit) board supported by a frame has an electronic chip secured thereto. The chip has a pair of heat exchange fins. Each fin projects through a groove and into a channel of a cooling module intermediate a cooling surface of the cooling module and an expansible conduit. Each expansible conduit is totally contained within one of the channels of the cooling module and has an expanded condition and a collapsed con- dition. When the conduits are in their collapsed condition, the fins can be inserted through the grooves and moved along the channels of the cooling module. When the conduits are in their expanded condition, they press against the fins to force the fins against the cooling surfaces of the cooling module to cool the chip. When the expansible conduits are collapsed, the fins can be withdrawn from the cooling module channels as the PC board is withdrawn from the frame.

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