Microelectronics apparatus and a method of interconnecting...

Details Microelectronics apparatus and a method of interconnecting... Microelectronics apparatus and a method of interconnecting...

H - Electricity

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L

356/134

H01L 27/02 (2006.01) H01L 21/48 (2006.01) H01L 21/70 (2006.01) H01L 23/538 (2006.01) H05K 1/00 (2006.01)

Patent

CA 1250372

A MICROELECTRONICS APPARATUS AND A METHOD OF INTERCONNECTING WIRING PLANES Abstract of the Disclosure A microelectronics apparatus and a method of fabricating customized connections between wiring planes superposed on a substrate is disclosed. A first wiring plane having multiple conductors is formed upon the substrate. An insulating layer is formed that overlies and electrically insulates the first wiring plane. A second wiring plane having multiple conductors is formed above the insulating layer by forming multiple conductors that are electrically connected to the first wiring plane with selected conductors of the first wiring plane being electrically connected to selected conductors of the second wiring plane. The connections may be modified by breaking selected ones of the electrical connections bet- ween the first and second wiring planes to customize the electrical interconnections.

519098

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