Method and apparatus for handling and processing wafer-like...

H - Electricity – 01 – L

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26/14

H01L 21/00 (2006.01) H01L 21/677 (2006.01) H01L 21/683 (2006.01) H01L 21/687 (2006.01)

Patent

CA 1300357

ABSTRACT OF THE DISCLOSURE An apparatus and method for moving a plurality of wafer-like articles such as semiconductor substrates back and forth between a carrier and a processing chamber maintained in an interior atmosphere isolated from that of the carrier. A translating arm pivotal about its center with a wafer engaging vacuum chuck at each end loads and retrieves articles from the carrier and exchanges articles at a support. The support centers an article thereon and translates it linearly to or from a load lock chamber. The chamber opens and closes about the article on the support to maintain isolation of the environments as the article passes therebetween. Within the interior atmosphere of the chamber, another arm pivotal at its center and having a vacuum chuck at each end exchanges articles on the support with still another arm, which is longitudinally rotatable and has a pair of vacuum chucks spaced both from a free end thereof, this arm being pivotal about its other end to move the articles in a horizontal plane, and then to rotate them to and from, and exchange them with, a vertical plane of the processing location. At all other times, the articles remain in a horizontal plane.

533791

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