Production of metallic patterns

G - Physics – 03 – F

Patent

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96/256, 204/97.0

G03F 7/038 (2006.01) G03F 7/00 (2006.01) H05K 3/06 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1333578

A method of making a metallic pattern on a substrate surface, the substrate surface comprising bare metal in predetermined areas and metal coated by a first resist in remaining areas which method comprises: (i) protecting the bare metal by electrodepositing a resinous film thereon; (ii) removing the first resist from said remaining areas using a solvent which does not remove the electrodeposited film; (iii) etching the metal exposed in (ii) using an etchant which does not remove the electrodeposited film; (iv) forming a layer of a second resist in a predetermined pattern over the electrodeposited film, thereby leaving areas of the electrodeposited film uncovered by the resist; and (v) removing the uncovered areas of the electro- deposited film by treatment with a solvent therefor. The method is useful in the production of printed circuit boards.

568036

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