Encapsulation for semiconductor integrated circuit chip

Details Encapsulation for semiconductor integrated circuit chip Encapsulation for semiconductor integrated circuit chip

H - Electricity

05

K

356/87

H05K 5/06 (2006.01) H01L 23/31 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1168764

- 11 - ABSTRACT ENCAPSULATION FOR SEMICONDUCTOR INTEGRATED CIRCUIT CHIP A plastic encapsulation of the chip carrier type for a semiconductor integrated circuit is described. The package includes a lead frame member formed from a continuous metal tape which permits reel-to-reel automatic processing. The lead frame member provides the entire means (12) for connecting from electrodes (15) on the active or front surface of the semiconductor chip (11) to contact members (13) external to the encapsulation. The lead frame member also includes integral backside contact members (16) providing electrical and thermal contact to the back surface of the semiconductor chip (11). The backside contact members (16) similarly are integral with contact members (17,18) external to the moulded plastics encapsulating body (10). The package can be made with very small dimensions and lends itself to a high degree of automatic fabrication, including handling in stick-type magazines for subsequent operations such as testing, aging, and assembly.

389899

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