Process for making substrates for printed circuit boards

H - Electricity – 05 – K

Patent

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Details

356/1, 18/63, 15

H05K 3/00 (2006.01) B32B 17/10 (2006.01) C08J 9/42 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1276758

ABSTRACT OF THE DISCLOSURE A process is provided for manufacturing a composite of a sheet of expanded, porous polytetrafluoroethylene (PTFE) impregnated with another resin, the other resin being impregnated within the pores of the expanded PTFE. The other resin imparts desired characteristics to the composite such as high thermal resistance and low dielectric constant which make it useful as substrates for printed circuit boards. The composite is useful as a dielectric generally and as an adhesive.

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