H - Electricity – 05 – K
Patent
H - Electricity
05
K
339/11.6
H05K 3/34 (2006.01) H01R 43/02 (2006.01)
Patent
CA 1282469
Abstract A lead structure adapted to be attached to a substrate having an array of conductive areas along at least one surface thereof, comprising a main body of conductive material having a substantially comb-like configuration, said main body including an array of elongated leads, each having a stem end and a free terminal end, with a carrier strip connected to said leads at their stem ends, said leads being in two sets, one set being adapted for cooperation with the conductive areas along one substrate surface, said leads being constructed and arranged such that the terminal ends of the leads in one set may be moved together in a first direction and the terminal ends of the leads in the other set may be moved together in an opposite direction simultaneously with movement of said one set, thereby to define a spacing between the terminal ends of the respective sets of leads, which spacing is at least as large as the thickness of the edge of said substrate, permitting said first set of terminal leads to be juxtaposed to said conductive areas on one substrate surface with the second set of terminal leads juxtaposed to the other substrate surface.
554770
North American Specialties Corporation
Smart & Biggar
LandOfFree
Solderable lead does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solderable lead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solderable lead will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1311424