Flexible copper-applied substrates

Details Flexible copper-applied substrates Flexible copper-applied substrates

B - Operations, Transporting

05

D

117/186, 117/240

B05D 7/24 (2006.01) B05D 7/00 (2006.01) C09D 179/08 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1324924

ABSTRACT OF THE DISCLOSURE The present invention provides flexible copper-applied substrates which have high adhesive strength and which can prevent curling substantially even when exposed to chemical` and thermal changes, and a process for preparing these substrates. The flexible copper-applied substrate of the present invention comprises a copper foil and a resin layer comprising a composite material of a polyimide having a repeating unit represented by the following general formula (I) and a polyimide silicone having a repeating unit represented by the following general formula (II), the aforesaid resin layer being directly formed on the surface of the copper foil: Image (I) Image Image Image Image (I) wherein R1, R2, R3, R4, RS and R6 are as defined in Claim 1, Y i5 -O-, -CO-, -SO2- or -CH2-, r is 2 or 3, x:y is 97-60:3-40, and m:n is 50-100:50-0.

603185

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