Heat sink for electronic components

Details Heat sink for electronic components Heat sink for electronic components

H - Electricity

01

L

356/113

H01L 23/34 (2006.01)

Patent

CA 1211861

PH. 25.110 ABSTRACT: A heat sink assembly especially adapted for use with semiconductors having flat packages such as of the TO-220 type wherein a heat sink mounting surface is bounded by two upstanding walls having outer edge flanges inturned over the mounting surface to cooperate with a spring clip to press a mounted component against the heat sink surface. Mounting bolts and/or holes in the mounting surface are dispensed with and the assembly is low cost and simple to use.

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