Thick film packages with common wafer aperture placement

Details Thick film packages with common wafer aperture placement Thick film packages with common wafer aperture placement

H - Electricity

01

L

356/143

H01L 23/28 (2006.01)

Patent

CA 1282497

ABSTRACT A multilayer thick film package for housing a microchip is formed from a series of insulating wafers. A wafer adapted to occupy an outer position on the package has a first series of apertures positioned to correspond with the placement of pins on the package, and wafers adapted to occupy inner positions on the package each have a second series of apertures. The second series of apertures is comprised of apertures that correspond in position to the first series of apertures, but is also comprised of additional apertures. Conductive material in the additional apertures allows electrical connection to be made within the package to the conductive lines that extend from the pins of the package to the inner package interface adapted to abut to a microchip. Two forms of the electrical connections are discussed. One form relates to connection of some of the conductive lines on a wafer to an electrically conductive coating at ground potential on one of the other wafers, this form being used in frequency sensitive applications. Another form relates to connection of some of the conductive lines on a wafer to a parallel line or lines on another wafer for reducing the resistance in the line in power sensitive applications. Packages capable of housing a variety of microchips may be formed from wafers each having only a first or a second series of apertures, thus reducing hard tooling cost.

572972

Affiliated with

Also associated with

Rating

Thick film packages with common wafer aperture placement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thick film packages with common wafer aperture placement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thick film packages with common wafer aperture placement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1315997