Mounting of saw devices

Details Mounting of saw devices Mounting of saw devices

H - Electricity

03

H

26/128, 333/14,

H03H 3/08 (2006.01) H03H 9/05 (2006.01)

Patent

CA 1281810

ABSTRACT OF THE DISCLOSURE A SAW device is formed by applying metallised areas to a surface of a SAW substrate and attaching conductive leads to the metallised areas. The substrate is inverted and located on a hybrid circuit so that the leads contact and are supported on conductive areas of the circuit. This mounting arrangement minimises the stresses which occur in the substrate in its operational life. A novel diamond- shape for the device is also disclosed.

474637

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