Stress relieved intermediate insulating layer for multilayer...

Details Stress relieved intermediate insulating layer for multilayer... Stress relieved intermediate insulating layer for multilayer...

H - Electricity

01

L

117/108, 356/141

H01L 21/768 (2006.01) H01L 21/3105 (2006.01) H01L 21/316 (2006.01) H01L 23/532 (2006.01) H01L 27/00 (2006.01)

Patent

CA 1246756

ABSTRACT OF THE DISCLOSURE There is disclosed herein a stress relieved intermediate insulating layer consisting of one or more layers of spun-on glass lying over a metalization pattern. The spun-on layers are allowed to crack from thermal stress imposed upon the structure. The cracks in the spun-on layers are then filled with a glass layer deposited by CVD or LPCVD.

512021

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