Multilayer hybrid integrated circuit

H - Electricity – 05 – K

Patent

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356/17, 96/174

H05K 3/06 (2006.01) G03F 7/027 (2006.01) H01L 23/538 (2006.01) H05K 1/00 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1254789

- 15 - MULTILAYER HYBRID INTEGRATED CIRCUIT Abstract A multilayer circuit device comprises a substrate having a plurality of metallized patterns thereon said patterns being separated by a pohotodefined polymeric dielectric film formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias through the polymeric film or film layers.

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